- •Contents
- •List of Tables
- •List of Figures
- •Preface
- •About this document
- •Feedback
- •Introduction
- •1.1 About the ARM PrimeCell MultiPort Memory Controller (PL172)
- •1.2 Supported dynamic memory devices
- •1.3 Supported static memory devices
- •Functional Overview
- •2.1 PrimeCell MPMC functional description
- •2.2 Overview of a PrimeCell MPMC, ASIC, or ASSP system
- •2.3 Low power operation
- •2.4 Lock and semaphores
- •2.5 Arbitration
- •2.6 Memory bank select
- •2.7 Memory map
- •Programmer’s Model
- •3.1 About the programmer’s model
- •3.2 Register descriptions
- •Programmer’s Model for Test
- •4.1 PrimeCell MPMC test harness overview
- •4.2 Scan testing
- •4.3 Test registers
- •Static Memory Controller
- •5.1 Static memory device selection
- •5.2 Write-protection
- •5.3 Extended wait transfers
- •5.4 Memory mapped peripherals
- •5.5 Static memory initialization
- •5.6 Byte lane control
- •5.7 Byte lane control and databus steering for little and big-endian configurations
- •Dynamic Memory Controller
- •6.1 Write-protection
- •6.2 Access sequencing and memory width
- •6.3 Address mapping
- •6.4 Dynamic memory controller command descriptions
- •6.5 Generic SDRAM initialization example
- •6.6 Micron MT48LC4M16A2 SDRAM initialization example
- •6.8 Micron MT28F4M16S2 SyncFlash initialization example
- •6.9 Micron SyncFlash commands
- •Common Memory Transactions
- •7.1 Static and dynamic memory transaction latency
- •Test Interface Controller
- •8.1 About TIC
- •8.2 Sequence of events leading to entry into TIC test mode
- •System Connectivity
- •9.2 Self-refresh entry
- •9.3 Example system
- •Off-chip Connectivity
- •10.2 Pin count reduction by reducing databus width
- •10.3 Pin count reduction by removing functionality
- •10.4 Address pin reduction
- •10.5 Chip select pin reduction
- •10.6 Device support
- •10.7 Multiplexing static and dynamic memory pins
- •10.8 Reducing pin count by multiplexing MPMC pins
- •10.9 About MPMC timing
- •10.10 On-chip timing path
- •10.11 Off-chip timing path
- •10.12 Clock strategy
- •10.13 Clock ratios
- •10.14 Memory clock and fed-back clock strategy
- •Pad Interface Timing
- •A.1 Overview
- •A.2 Signal delay
- •A.3 Method to reduce delay
- •A.4 Methods to reduce skew
- •A.5 Methods to minimize the effects of delay and skew
- •A.6 Example SDRAM memory timing diagram
- •A.7 SDRAM memory timing paths
- •Troubleshooting
- •B.1 Troubleshooting
- •C.1 AHB register signals
- •C.2 AHB memory signals
- •C.3 Miscellaneous and clock signals
- •C.4 Pad interface and control signals
- •C.5 Test Interface Controller (TIC) signals
- •C.6 Scan test signals
Off-chip Connectivity
10.8Reducing pin count by multiplexing MPMC pins
Multiplexing MPMC pins has a detrimental effect on pad interface performance. This is because both on and off-chip loading is increased.
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Copyright © 2002 ARM Limited. All rights reserved. |
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Off-chip Connectivity
10.9About MPMC timing
The on-chip path (the path from the MPMC to the pads), and the off-chip path (the path from the chips I/O pins to the memory devices) are critical for high-speed operation.
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Off-chip Connectivity
10.10 On-chip timing path
To enable high-speed operation:
•The skew between the MPMC pad interface output signals should be minimized. This is achieved by:
—the MPMC providing four output clocks, MPMCCLKOUT[3:0], to reduce clock signal loading
—the MPMC registering all the output signals before they are sent off chip to minimize skew between the signals
—The system designer situating the MPMC as close to the pads as possible to minimize signal delay and skew
—the system designer not multiplexing the MPMC output signals, because this unnecessarily loads the off-chip signals
—the system designer using the appropriate strength pads for the output signals.
•The skew between the MPMC pad interface input signals should be minimized. This is achieved by:
—the MPMC using a fed-back clock that is ideally fed-back from the memory devices clock pin
—the MPMC providing four fed-back clocks, MPMCFBCLKIN[3:0], to better track the delays of the return data path
—the MPMC registering the input signals, using the MPMCFBCLKIN signals
—the system designer situating the MPMC as close to the pads as possible to minimize signal delay and skew
—the system designer not multiplexing the MPMC input signals, because this unnecessarily loads the signals and can skew the signals
—the system designer using the appropriate strength pads for the input signals.
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Copyright © 2002 ARM Limited. All rights reserved. |
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Off-chip Connectivity
10.11 Off-chip timing path
You must minimize the skew between the various signals during PCB routing.The off-chip path from the ASIC pads to the dynamic memory devices must be as lightly loaded as possible to enable high-speed operation. Therefore, you must minimize the number of memory devices for high-speed operation.
For systems that require a large number of memory devices, additional buffering of the I/O signals might be required. For example, the signals to the static memory devices can be buffered. This adds additional delay when accessing static memories, but enables the dynamic devices to run at a higher speed.
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