- •Contents
- •List of Tables
- •List of Figures
- •Preface
- •About this document
- •Feedback
- •Introduction
- •1.1 About the ARM PrimeCell MultiPort Memory Controller (PL172)
- •1.2 Supported dynamic memory devices
- •1.3 Supported static memory devices
- •Functional Overview
- •2.1 PrimeCell MPMC functional description
- •2.2 Overview of a PrimeCell MPMC, ASIC, or ASSP system
- •2.3 Low power operation
- •2.4 Lock and semaphores
- •2.5 Arbitration
- •2.6 Memory bank select
- •2.7 Memory map
- •Programmer’s Model
- •3.1 About the programmer’s model
- •3.2 Register descriptions
- •Programmer’s Model for Test
- •4.1 PrimeCell MPMC test harness overview
- •4.2 Scan testing
- •4.3 Test registers
- •Static Memory Controller
- •5.1 Static memory device selection
- •5.2 Write-protection
- •5.3 Extended wait transfers
- •5.4 Memory mapped peripherals
- •5.5 Static memory initialization
- •5.6 Byte lane control
- •5.7 Byte lane control and databus steering for little and big-endian configurations
- •Dynamic Memory Controller
- •6.1 Write-protection
- •6.2 Access sequencing and memory width
- •6.3 Address mapping
- •6.4 Dynamic memory controller command descriptions
- •6.5 Generic SDRAM initialization example
- •6.6 Micron MT48LC4M16A2 SDRAM initialization example
- •6.8 Micron MT28F4M16S2 SyncFlash initialization example
- •6.9 Micron SyncFlash commands
- •Common Memory Transactions
- •7.1 Static and dynamic memory transaction latency
- •Test Interface Controller
- •8.1 About TIC
- •8.2 Sequence of events leading to entry into TIC test mode
- •System Connectivity
- •9.2 Self-refresh entry
- •9.3 Example system
- •Off-chip Connectivity
- •10.2 Pin count reduction by reducing databus width
- •10.3 Pin count reduction by removing functionality
- •10.4 Address pin reduction
- •10.5 Chip select pin reduction
- •10.6 Device support
- •10.7 Multiplexing static and dynamic memory pins
- •10.8 Reducing pin count by multiplexing MPMC pins
- •10.9 About MPMC timing
- •10.10 On-chip timing path
- •10.11 Off-chip timing path
- •10.12 Clock strategy
- •10.13 Clock ratios
- •10.14 Memory clock and fed-back clock strategy
- •Pad Interface Timing
- •A.1 Overview
- •A.2 Signal delay
- •A.3 Method to reduce delay
- •A.4 Methods to reduce skew
- •A.5 Methods to minimize the effects of delay and skew
- •A.6 Example SDRAM memory timing diagram
- •A.7 SDRAM memory timing paths
- •Troubleshooting
- •B.1 Troubleshooting
- •C.1 AHB register signals
- •C.2 AHB memory signals
- •C.3 Miscellaneous and clock signals
- •C.4 Pad interface and control signals
- •C.5 Test Interface Controller (TIC) signals
- •C.6 Scan test signals
Chapter 7
Common Memory Transactions
This chapter describes transactions for both dynamic and static memory accesses. It contains the following section:
•Static and dynamic memory transaction latency on page 7-2.
ARM DDI 0215A |
Copyright © 2002 ARM Limited. All rights reserved. |
7-1 |
Common Memory Transactions
7.1Static and dynamic memory transaction latency
This section describes common transactions for static and dynamic memory accesses in the following subsections:
•Summary
•Miscellaneous transactions
•Buffer hit transactions on page 7-4.
7.1.1Summary
The following values assume CAS latency 2 SDRAM, where CAS, RAS and Precharge (tRP) are 2 clock cycles.
The latency heading shows the latency seen by the AHB interface, where the request is dealt with immediately.
7.1.2Miscellaneous transactions
Miscellaneous transactions are described in:
•Write transfer to write protected chip select
•Auto refresh cycle on page 7-3.
Write transfer to write protected chip select
Figure 7-1 on page 7-3 shows a write transaction to a write protected bank. The MPMC responds by placing an ERROR response on HRESP[1:0].
7-2 |
Copyright © 2002 ARM Limited. All rights reserved. |
ARM DDI 0215A |
Common Memory Transactions
HCLK
HSELMPMC
HADDR
Control
HWRITE
HREADYOUT
HRESP[1:0]
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A0
C0
ERROR ERROR
Figure 7-1 A write transfer to a write protected chip select
Auto refresh cycle
Figure 7-2 shows an auto-refresh cycle.
MPMCCLKOUT
MPMCDYCSOUT[0]
MPMCDYCSOUT[1]
MPMCDYCSOUT[2]
MPMCDYCSOUT[3]
SDRAM Cmd
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Auto-refresh Auto-refresh Auto-refresh Auto-refresh |
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Figure 7-2 An SDRAM auto-refresh cycle
ARM DDI 0215A |
Copyright © 2002 ARM Limited. All rights reserved. |
7-3 |
Common Memory Transactions
7.1.3Buffer hit transactions
The following section provides the access times for read and write transfers that hit the buffers.
Both static and dynamic transfers that hit the buffer have the timings provided below.
The latency values provided show the latency seen by the AHB interface, where the request is dealt with immediately. However, for write accesses the data is written to memory later.
Read access timing
Nonsequential transfers (HTRANS=NONSEQ) have a latency of two cycles. Sequential transfers (HTRANS=SEQ), including burst transfers, have a transfer latency of one cycle if they hit a previously accessed buffer. If the buffer was not previously opened the transfer takes two cycles.
Write access timing
Nonsequential transfers (HTRANS=NONSEQ) have a latency of two cycles. Sequential transfers (HTRANS=SEQ) including burst transfers have a transfer latency of one cycle if they hit a previously accessed buffer. If the buffer was not previously opened the transfer takes two cycles.
Table 7-1 shows the buffer access latency.
Table 7-1 Buffer access latency
Access type |
Burst |
Buffer |
Latency |
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types |
commands |
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Four word burst read. All transfers hit the same quad word of data. |
INCR, INCR4, |
Read x 4 |
5 |
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WRAP4 |
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Three sequential read transfer. All transfers hit the same quad word of |
SINGLE |
Read x 3 |
4 |
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data. |
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Three nonsequential reads. |
SINGLE |
Read x 3 |
6 |
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Read. |
SINGLE |
Read x 1 |
2 |
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Eight word burst read. |
INCR8, |
Read x 8 |
11 |
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WRAP8 |
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Two simultaneous four word burst read transfers from different AHB |
INCR, INCR4, |
Read x 4 (x2) |
11 |
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WRAP4 |
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Four word burst write. All transfers hit the same quad word of data. |
INCR, INCR4, |
Write x 4 |
5 |
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WRAP4 |
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7-4 |
Copyright © 2002 ARM Limited. All rights reserved. |
ARM DDI 0215A |
Common Memory Transactions
Table 7-1 Buffer access latency (continued)
Access type |
Burst |
Buffer |
Latency |
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types |
commands |
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Three sequential write transfer. All transfers hit the same quad word of |
SINGLE |
Write x 3 |
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Three nonsequential writes. |
SINGLE |
Write x 3 |
6 |
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Write. |
SINGLE |
Write x 1 |
2 |
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Write. |
INCR8, |
Read x 4 |
11 |
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Two simultaneous four word burst write transfer from different AHB |
INCR, INCR4, |
Write x 4 |
11 |
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WRAP4 |
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7.1.4Buffer hit transaction waveforms
Figure 7-3 shows a four word INCR burst, or INCR4, or WRAP4 burst read transfers that hit the buffer. The waveform shows the case where all transfers hit the same quad word of data.
T1 |
T2 |
T3 |
T4 |
T5 |
T6 |
T7 |
T8 |
T9 |
HCLK
HSELMPMC
HADDR
Control
HBURST[2:0]
HTRANS[1:0]
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HWRITE
HREADYOUT
HRDATA |
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Figure 7-3 An INCR, INCR4, or WRAP4 burst read transfer, buffer hit
ARM DDI 0215A |
Copyright © 2002 ARM Limited. All rights reserved. |
7-5 |
Common Memory Transactions
Figure 7-4 shows three sequential reads, of burst type SINGLE from a buffer. The waveform shows the case where all transfers hit the same quad word of data.
T1 |
T2 |
T3 |
T4 |
T5 |
T6 |
T7 |
T8 |
T9 |
HCLK
HSELMPMC
HADDR
Control
HBURST[2:0]
HTRANS[1:0]
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SINGLE |
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SINGLE |
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NON SEQ |
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SEQ |
SEQ |
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HWRITE
HREADYOUT
HRDATA |
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Figure 7-4 Three sequential reads, burst type SINGLE, read transfer, buffer hit
7-6 |
Copyright © 2002 ARM Limited. All rights reserved. |
ARM DDI 0215A |
Common Memory Transactions
Figure 7-5 shows three nonsequential reads, of burst type SINGLE from a buffer.
T1 |
T2 |
T3 |
T4 |
T5 |
T6 |
T7 |
T8 |
T9 |
HCLK
HSELMPMC
HADDR
Control
HBURST[2:0]
HTRANS[1:0]
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SINGLE |
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NON SEQ |
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NON SEQ |
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NON SEQ |
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HWRITE
HREADYOUT
HRDATA |
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Figure 7-5 Three nonsequential reads, burst type SINGLE, read transfer, buffer hit
ARM DDI 0215A |
Copyright © 2002 ARM Limited. All rights reserved. |
7-7 |
Common Memory Transactions
Figure 7-6 shows an INCR8, or WRAP8 burst read transfers that hit the buffer. The waveform shows the case where transfers start on a quad word boundary.
T1 |
T2 |
T3 |
T4 |
T5 |
T6 |
T7 |
T8 |
T9 |
T10 |
T11 |
T12 |
T13 |
HCLK
HSELMPMC
HADDR
Control
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HBURST[2:0]
HTRANS[1:0]
INCR8/WRAP8
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HRDATA |
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Figure 7-6 An INCR8 or WRAP8 burst read transfer, buffer hit
7-8 |
Copyright © 2002 ARM Limited. All rights reserved. |
ARM DDI 0215A |
Common Memory Transactions
Figure 7-7 shows two simultaneous INCR, INCR4, or WRAP4 burst read transfers which hit the buffer. The waveform shows the case where transfers start on a quad word boundary.
HCLK
HSELMPMC1
HADDR1
Control1
HBURST1[2:0]
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HTRANS1[1:0]
HWRITE1
HREADYOUT1
HRDATA1
HSELMPMC2
HADDR2
Control2
HBURST2[2:0]
HTRANS2[1:0]
HWRITE2
HREADYOUT2
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D4 D5 D6 D7
Figure 7-7 Two simultaneous INCR, INCR4, or WRAP4 burst read transfer, buffer hit
ARM DDI 0215A |
Copyright © 2002 ARM Limited. All rights reserved. |
7-9 |
Common Memory Transactions
Figure 7-8 shows a four word INCR, INCR4, or WRAP4 burst write transfer to a buffer. The waveform shows the case where all transfers hit the same quad word of data. The data is written to memory later.
T1 |
T2 |
T3 |
T4 |
T5 |
T6 |
T7 |
T8 |
T9 |
HCLK
HSELMPMC
HADDR
Control
HBURST[2:0]
HTRANS[1:0]
A0 |
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INCR/INCR4/WRAP4 |
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NON SEQ |
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HWRITE
HREADYOUT
HWDATA |
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Figure 7-8 Four word INCR, INCR4, or WRAP4 burst write
7-10 |
Copyright © 2002 ARM Limited. All rights reserved. |
ARM DDI 0215A |
Common Memory Transactions
Figure 7-9 shows three sequential write transfers to a buffer. The waveform shows the case where all transfers hit the same quad word of data. The data is written to memory later.
T1 |
T2 |
T3 |
T4 |
T5 |
T6 |
T7 |
T8 |
T9 |
HCLK
HSELMPMC
HADDR
Control
HBURST[2:0]
HTRANS[1:0]
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HREADYOUT
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Figure 7-9 Three sequential write transfers
ARM DDI 0215A |
Copyright © 2002 ARM Limited. All rights reserved. |
7-11 |
Common Memory Transactions
Figure 7-10 shows three nonsequential write transfers to a buffer. The data is written to memory later.
T1 |
T2 |
T3 |
T4 |
T5 |
T6 |
T7 |
T8 |
T9 |
HCLK
HSELMPMC
HADDR
Control
HBURST[2:0]
HTRANS[1:0]
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HWRITE
HREADYOUT
HWDATA |
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Figure 7-10 Three nonsequential write transfers
7-12 |
Copyright © 2002 ARM Limited. All rights reserved. |
ARM DDI 0215A |
Common Memory Transactions
Figure 7-11 shows an INCR8 or WRAP8 burst write transfer to a buffer. The waveform shows the case where transfers start on a quad word boundary.The data is written to memory later.
T1 |
T2 |
T3 |
T4 |
T5 |
T6 |
T7 |
T8 |
T9 |
T10 |
T11 |
T12 |
T13 |
HCLK
HSELMPMC
HADDR
Control
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HBURST[2:0]
HTRANS[1:0]
INCR8/WRAP8
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HWDATA |
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D7 |
Figure 7-11 INCR8 or WRAP8 burst write
ARM DDI 0215A |
Copyright © 2002 ARM Limited. All rights reserved. |
7-13 |
Common Memory Transactions
Figure 7-12 shows two simultaneous INCR, INCR4, or WRAP4 burst write transfers that hit the buffer. The waveform shows the case where transfers start on a quad word boundary.
HCLK
HSELMPMC1
HADDR1
Control1
HBURST1[2:0]
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HTRANS1[1:0]
HWRITE1
HREADYOUT1
HRDATA1
HSELMPMC2
HADDR2
Control2
HBURST2[2:0]
HTRANS2[1:0]
HWRITE2
HREADYOUT2
HRDATA2
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D4 D5 D6 D7
Figure 7-12 Two simultaneous INCR, INCR4, or WRAP4 burst write transfer, buffer hit
7-14 |
Copyright © 2002 ARM Limited. All rights reserved. |
ARM DDI 0215A |