- •Introduction
- •Outline
- •PWB Construction
- •PWB/CCA Examples
- •Types of Rigid PWB
- •Types of Flex PWB
- •Footnotes on Flex PWBs
- •PWB Stack-Ups (1 and 2 Layer)
- •Multi-Layer PWBs
- •Exploded View of Multi-Layer PWB
- •Multi-Layer Stack-Up Examples
- •PWB Stack-Up Guidelines
- •PWB Materials
- •PWB Materials
- •PWB Material Examples
- •Dielectric, Common Thickness
- •Copper Options
- •Etch-Back
- •Etch-Back
- •Signal Distribution
- •Single Ended Structure Examples
- •Differential Structure Examples
- •PWB traces as Transmission Lines
- •Characteristic Impedance
- •Trace Impedance
- •Strip-Line & Micro-Strip Impedance
- •Asymmetrical Strip-Line Impedance
- •Impedance Examples
- •Loss
- •Conductor Loss
- •Loss due to Skin Effect & Roughness
- •Time Delay
- •Signal Dispersion
- •Signal Dispersion
- •Signal Dispersion Example
- •Mitigation of Dispersion
- •Coupling
- •Coupling Examples
- •Mitigation of Coupling
- •Differential Pairs
- •Differential Pair Routing Options
- •Differential Impedance Definitions
- •Differential Impedance Examples
- •Field Intensity - 1
- •Field Intensity – 2
- •Field Intensity - 3
- •Field Intensity - 4
- •PWB Pad and Trace Parameters
- •Vias
- •Fine Pitch BGA (FG456) Package
- •Fine Pitch BGA (FG1156) Package
- •Via Parameters
- •Source Terminations
- •Destination Terminations
- •“Intentional” Mismatch Example
- •“Intentional” Mismatch Example
- •Power Distribution Purpose
- •Supply Power Loss Budget
- •DC Loss Model
- •Power Distribution Considerations
- •Plane Capacitance, Inductance, Resistance
- •Capacitor Parameters
- •Capacitor Parameters
- •Capacitor Guidelines
- •Capacitor Mounting Pads
- •Decoupling Examples
- •Trace Width Example
- •References
- •References (continued)
- •Material Suppliers
- •PWB Fabricators
- •Design Tools
Multi-Layer PWBs
♦Option for dedicating layers to ground
-Forms reference planes for signals
-EMI Control
-Simpler impedance control
♦Option for dedicating layers to Supply Voltages
-Low ESL/ESR power distribution
♦More routing resources for signals
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Copyright Telephonics 2002-2005 |
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Exploded View of Multi-Layer PWBPWB
♦Core Construction
- As shown
♦ Foil Construction
- Reverse core and pre-preg
Pre-Preg
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Core |
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Artwork
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Multi-Layer Stack-Up Examplesles
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Ground Plane |
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Supply Plane |
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Digital Signal |
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High Speed Digital PWB |
High Speed Digital PWB |
Mixed Analog/RF/Digital PWB |
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High Density |
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Moderate Density |
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Ten Layers |
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Six Layers |
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Two Micro-Strip |
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Two Micro-Strip Routing Layers |
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Routing Layers |
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Four Asymmetrical Strip-Line |
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Two Buried Micro-Strip |
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Strip-Line Routing |
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Single Supply Plane |
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Two Sided |
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- Routing Clearance Considerations |
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Two Sided |
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Copyright Telephonics 2002-2005 |
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PWB Stack-Up Guidelines
♦Maximize symmetry to simply manufacturing and to mitigate warping
♦Even number of layers preferred by PWB manufacturers
♦Asymmetrical strip-line has higher routing efficiency than symmetrical strip-line
♦Supply planes can be used as reference planes for controlled Z (but not preferred for analog)
♦Ideally, supply planes should be run adjacent to ground planes
Revision 4 |
Copyright Telephonics 2002-2005 |
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