Embedded system engineering magazine 2005.06
.pdf
boards and NI SPEEDY-33 boards with signal processing functions and programming constructs, such as spectral analysis and filtering, without requiring a separate DSP compiler. The LabVIEW intuitive graphical environment helps engineers to reduce iteration design cycles and overall development time and make changes in real time on their actual DSP hardware to instantly display results. It is seen as suitable for application areas such as communications, custom-control algorithms, digital and least-mean-square (LMS) filtering and audio processing and analysis.
The DSP Module integrates with the new NI LabVIEW Digital Filter Design Toolkit, which includes tools for modeling and creating softwarebased digital filters as well as FPGA code-genera- tion capabilities for chip-level implementation.
NI is also making the new products available through their academic site license packages, giving students an opportunity to gain hands-on experience of real implementations.
www.ni.com
Reference designs
MIMO wireless
Jungo and Airgo have released a productionready hardware and software reference design for residential and office gateways with 802.11 MIMO wireless networking capabilities, based on Jungo's software platform and Airgo's True MIMO wireless chipset.
www.jungo.com / www.airgonetworks.com
Bluetooth
Socket has launched the KwikBlue Module Development Kit using Socket’s KwikBlue modules. Typical module designs include PDAs, mobile printers, serial dongles, industrial automation equipment, bar code scanning and conference room whiteboard connectivity.The kit provides an adapter board that enables the KwikBlue Module to communicate with a standard computer interface and includes Bluetooth stack software development tools, reference documentation and support hardware. www.socketcom.com/embedded/bluetooth.asp
COM Express
Kontron claims to be the first company to offer a starter kit for computer-on-module technology based on the COM Express standard. An ATX baseboard serves as the evaluation board, with PCI Express, PCI Express Graphics, serial ATA and USB 2.0. The Kontron ETXexpress-PM module is based on a Pentium M processor and an Intel 915GM chipset,, with PCI Express functionality and extended support over the entire product lifetime. www.kontron.com
Gigabit Ethernet
Agere’s GigEasy is a Universal Serial Bus 2.0 to Gigabit Ethernet adapter and GigX is an ExpressCard™ form-factor Gigabit Ethernet adapter. The design kits are available as a fully packaged consumer quality product.
GigEasy turns a USB 2.0 port into a Gigabit Ethernet local area network connection, while GigX enables the PC to support 10/100/1000Base-T Ethernet in a compact minisize ExpressCard. www.agere.com
Cyan evaluation board
Cyan's new microcontroller evaluation board is complete with the CyanIDE Integrated Development Environment for 60 Euros (£42). It is for development, configuration and debugging of the Cambridge-based company's 16-bit eCOG1k Microcontroller.
It includes free of charge a complete suite of software tools, including a full ANSI C-Compiler which is not code or time limited. The 3.5" (90mm) square board is powered by the USB bus www.cyantechnology.com
</News - Tools>
<News - Boards>
ESE Magazine June 05
Boards
EMC filters for DIN rail
SCHAFFNER HAS has introduced the FN 2412 series of DIN Rail mounting EMC Filters. They fit industry standard TS 35 DIN rails and provide con-
ducted EMC suppression for panel builders and control cabinet manufacturers.
26 different models are available off the shelf, with the aim of providing system conformity within the limits of EN 60950 - Class A. High saturation resistance gives high attenuation performance with very aggressive noise sources and under full load.
They are designed for a maximum continuous operating voltage of 250 VAC and for rated currents from 8 to 45 A. There is also a standard version FN 2412H available for higher operating voltages up to 520 VAC. All models are safety agency approved to UL, CSA and ENEC and are RoHS compliant.
For chassis mounting where Din Rail mounting is not possible, the FN 2410 range operates in same voltage ranges and with the current range extended to 100 A.
www.schaffner.com/uk
3U with PowerPC and FPGA
VMETRO’S 3CPF1 is a signal processing engine combining a Xilinx Virtex-II Pro FPGA (XC2VP70), a Freescale PowerPC CPU (7447A) and multi-channel
communications in a rugged 3U form-factor board. It is for applications that require complex signal processing closely coupled to high bandwidth data I/O in an environment where space is at a premium. Typical applications include ElectroOptics (EO), Signal Intelligence (SigInt) and
Electronic Warfare (EW).
Using FPGAs for signal processing tasks can lead to significant increases in speed. For example, an FFT can be calculated 10 to 20 times faster on the FPGA than on the PowerPC. The FPGA’s performance capability is further increased by six independent banks of memory, four banks of 2M x 18-bit QDR-II SRAM and two banks of 64MBytes DDR SDRAM.
A Marvell MV64360 bridge links the PC and FPGA, as well as 512MBytes of SDRAM, flash memory, Gigabit Ethernet channels and serial I/O.
www.vmetro.com
For a more detailed look at these stories please visit
www.esemagazine.co.uk
PICMG 1.2 compatible CPU assembly
With the ePCI-201, Kontron introduces a new PICMG 1.2 compatible full-size slot CPU assembly which is equipped with Pentium 4 processors with up to 3.0 GHz and communicates with expansion assemblies via the backplane with up to 64 bit / 66 MHz.
It is designed for high-performance and I/O- intensive application fields where up to 6 PCI(-X)- based expansion assemblies may be used, and for applications that require fast RAM access, CPUs and peripheral buses, like multimedia, image recognition, medical technology, or telecommunications applications such as VoIP or HLR/SCP (Home Location Register/Service Control Point).
The standard feature set includes a front-side bus up to 800 MHz, dual channel DDR RAM, two serial ATA interfaces, on-board ATI Mobility Radeon M7 video controller, two Gigabit Ethernet ports, as well as 64 bit / 66 MHz PCI bus support. Furthermore, the ePCI955 offers an EIDE hard drive interface, a Compact Flash module connector, four USB 2.0 ports, two serial interfaces, floppy disk controller and its own controller for monitoring the board functions. Moreover, the additional mezzanine card offers two more USB 2.0 ports, a composite video input and a second VGA interface for parallel operation of two monitors. Software support is offered for Windows 2000/XP and Linux.
www.kontron.com
New board architecture
Curtiss-Wright Controls, Embedded Computing has announced its plans for a new architecture called COTS Continuum. It supports migration between product generations, between board standards such as VITA 46, VITA 41, VME64x and cPCI, and to emerging embedded computing technologies such as FPGA-based reconfigurable computing platforms.
The first product based on the COTS Continuum architecture will be the SVMX/DVMX185, a single board computer based on the new VITA 46 switched serial fabric standard.
www.cwcembedded.com
Fanless 3.5" SBC
Advantech’s new 3.5” embedded SBC, the PCM-9380, is based on the 2GHz low power Pentium M processor and uses Intel’s 855GME and IC4H chipset.
Designed for applications requiring lowpower consumption or fan-less operation, the PCM-9380 uses Advantech’s with new Module I/O interface. It delivers 400 MHz Front Side Bus speed, supports DDR memory up to 1GB with ECC, includes VGA/LCD/LVDS connectors for dual independent displays and 1000Base-T Ethernet for Gigabit networking.
Advantech designed the open-pin definition MIO to be simple and versatile. It integrates the most popular bus signals together into a high-density 160-pin
AMD-based VMEbus computers
Themis Computer, who have just opened a UK office, is shipping members of a new family of TOP64 VMEbus computers. They are the first in a new family of 6U VMEbus computer boards and are based on AMD's Mobile Athlon 64 processor.
The TOP64-LP is backward compatible with the USBIIe Single Board Computer, at the application source code level, and features front panel and backplane compatibility, including all I/O, switches and indicators. The TOP64-LP runs 32-bit SunSolaris 8 and 9,
and 64-bit Solaris 10, Windows and Linux. An on-board PMC Slot and inter-board
stacking connector allows expansion for graphics and PMC carrier cards. Boards include a high performance Universe II VME64x interface, dual Ultra320 interface, two 10/100/1000 Ethernet ports, two or more USB ports, AC97 audio, two serial ports, and one PS/2 port. They are available in one, two and three slot configurations.
www.themis.com
12
connector. These include PCI, High-Speed USB 2.0, Digital Video Output, Low Pin Count , and AC97 audio. Because the MIO connector interfaces directly with other modules there are fewer cables and better thermal heat dissipation. Add-on modules include MIO253 with 4 serial port support, MIO-254 with TV- out/S-Video, and DVI interfaces, and MIO-250 with 3 fast Ethernet ports for Industrial Automation, Kiosk/Retail, and Networking applications.
www.advantech-uk.com
Ethernet switching and routing
SBS has introduced two 3U 10-port CompactPCI Gigabit Ethernet switches for commercial temperature conditions and a conduction-cooled version for rugged, heat-sensitive environments. The CP3GESW12M3, CP-GESW12M3R and CP3GESW12M3N 10-port switches provide high-speed network connectivity for both commercial and military applications.
Designed for flexible Layer-2 switching and Layer-3 IP network routing, these managed Gigabit Ethernet switch boards require no host intervention or software drivers. They can be managed using SSH CLI or Telnet via the RS-232 serial interface or by HTTP or SNMP over Ethernet. They perform all Layer-2 Ethernet switching functions and run Layer-3 routing protocols including OSPF, BGP-4, IP Multicasting and QoS.
The rugged versions conform to 10 different VITA 47 rugged levels, which specify shock, vibration, altitude, and temperature, Built-in test (BIT) functionality allows remote testing while the boards are still installed in the system. Compatible with 3U CompactPCI slots, the CP3-GESW12M3 connects only to the power and hot swap signals, is operating system independent and does not require host CPU intervention. Ethernet 10BaseT, 100BaseTX and 1000BaseT physical interfaces are supported. The conduction-cooled CP3-GESW12M3N has the same features and functionality as the CP3-GESW12M3 plus enhanced environmental protection with conduction cooling, with an operating temperature range of -40°C to +85°C. The CP3-GESW12M3R adds ruggedisation for an operating temperature range of -40°C to +70°C.
www.sps.com
COM for multimedia
Anders’ new system-on-module CM-iVC3 is designed for advertising, point-of-sale, gaming and entertainment kiosks, information terminals, and the latest in-car entertainment devices.
Supplied as a single board measuring 68 x 85mm, the new CM-iVC3 COM is based on the VIA Eden low-power CPU running without a cooling fan at speeds up to 1GHz.
Integrated functions and peripherals include a dual head SXGA graphics controller for two independent LCD or CRT displays, an MPEG 1/2 decoder, a video input port, sound I/O, highspeed USB 2.0 and a touchscreen controller. There are also a 16-512MB of Flash disk, 64-
256MB of DDR memory, PCI and LPC connectivity, 10/100BaseT Ethernet, UARTs and I/O lines. Extra electronics required – such as additional I/O – can be added to a customised base board.
www.anders.co.uk
</News - Boards>
</Event Preview>
ESS 2005 - The UK's
Embedded Systems Show
NEC, Birmingham 19th & 20th October 2005
The ESS 2005 Conference has expandsignificantly to provide a wide range of -quality tracks covering both hardware software engineering.
We are joined by the editors of Electronics Weekly, the Object Management Group and the Professional Networks of the Institution of Electrical Engineers (IEE) as co-organisers and promoters of the Conference to ensure that ESS remains the UK's foremost event for the embedded systems community.
IEE brings focus on FPGA development
A group of the world's top FPGA developers have been enlisted to share their expertise with the electronics industry at one of Europe's leading FPGA events. The Embedded Systems Show will host the IEE's own FPGA Developer Forum as an integral part of the technical conference, bringing together the increasingly closely related worlds of reconfigurable and embedded hardware.
FPGA device costs have plummeted in the past 5 years, plus performance and power consumption
Feature-rich Pentium M EBX Size |
||||||
|
Embedded-PC |
|
|
|||
High Functionality |
|
|
|
|
||
|
Memory |
CompactFlash |
TV OUT |
OEM |
CRT |
AGP option ATI® |
|
|
|
|
|
|
5V only |
|
|
|
|
|
|
required |
|
|
|
|
|
|
1GB |
|
|
|
|
|
|
Ethernet |
|
|
|
|
|
|
Analogue |
inches/146mm |
|
|
|
|
|
Digital In/Out |
|
|
|
|
|
IDE |
|
|
|
|
|
|
4 x USB2 |
|
5.75 |
|
|
|
|
|
|
|
|
|
|
|
|
Serial |
|
|
|
|
|
|
1&2 |
|
|
|
|
|
|
RS232/422 |
|
|
|
|
|
|
485 |
Serial 3,4,5,6 |
LVDS |
2/4 PAL |
AC97 AUDIO |
PCI-104 |
MINI-PCI |
|
RS232/TTL |
|
NTSC inputs |
|
|
|
|
MAT 1111 |
|
|
Low Power 16 watts |
|||
• Intel® Pentium® M/Celeron to 1.8GHz |
|
|
|
|
||
• Intel® 855GME Chipset, 1GB DDR |
Call for a brochure |
|||||
• 10/100/1Gbit Intel® Ethernet |
||||||
• CompactFlash™ (Type I and Type II) |
+44 (0)1628 537333 |
|||||
• Two video capture channels, 4 inputs |
email: sales@microbus.com |
|||||
• AGP options of nVidia® & ATI™ |
|
|
|
|
||
• Mini-PCI and PCI-104 expansion |
|
|
|
|
||
www.embedded-pc.com |
|
<> Microbus |
||||
|
|
B e t t e r |
b y d e s i g n |
|||
have improved so that new application areas, which have traditionally been the sole domain of standard microcontrollers, now appear viable. The most pertinent criterion for design technology in the next generation of multimedia applications for “4G wireless” and further consumer devices is said by many commentators to be the ability to dynamically reconfigure hardware and software to work on a variety of platforms and protocols.
Attendees will be able to learn for themselves whether the FPGA vendors are able to provide a viable alternative to today's technology.
Focus on signal integrity engineering
A one-day track will address the practical challenges for embedded system hardware engineers implementing multi-gigabit designs on printed circuit boards. With increasing bus speeds being driven by new standards such as PCI Express, Gigabit Ethernet and Rapid IO, engineers are likely to face serious difficulties with jitter, board yield, via design, reflection and signal integrity.
Modern circuit board design and development is fundamentally more demanding as signals increase in frequency and digital signal edge rates decrease. Copper tracks decrease their transparency as signals increase their speed. The major circuit board issues are to do with transmission line effects, such as maintaining uniform impedances and minimising reflections. Moreover, how can circuit board designers maintain signal integrity and limit cross-talk, EMI and ground bounce?
Further issues occur for developers of populated boards in simulation, real-time test and debug of the system. The interrelationships between device simulation, circuit simulation and real-time measurement are increasingly important application areas, particularly as we move into the era of high-speed serial buses and LVDS. How can simulation tools and electronic bench instrumentation enable the embedded system engineer to develop, test and debug modern high-speed systems?
The track aims to provide system hardware design engineers and their managers with a balanced view of the problems they will face and the solutions they may use in designing state-of-the-
art hardware and systems. |
<Ends> |
www.embedded.co.uk |
|
Exhibition Update
The exhibition is set to be up to 50% larger this year - new exhibitors include Toshiba, LSI Logic, Altera, Actel, Lattice Semiconductor, Synplicity, Bluegiga, M-Systems and Radisys. In addition the DTI makes a welcome return with a big roll-out of its Nextwave Technologies initiative for Pervasive Computing.
Full listing:
Accelerated Technology (Mentor Graphics), 2001 Electronics, Accelonix, Actel, AGP Micro, Altera, Asidua, Blue Horizon, Bluegiga, CML Microcircuits, Cyan Technology, Digi, dSPACE, DTI - Nextwave Technologies, ECE Magazine , Electronics Weekly, Elsevier/ Newnes, ENEA Embedded Technology, Eointec Solutions, esmertec, Green Hills Software, Hero Electronics, Hitex, Infoteam Software, iSYSTEM, Kennedy Carter, Lantronix, Lattice Semiconductor, LDRA, Lexcom, Logic Technology, LSI Logic, McObject, Miles Industrial Electronics, MKS, M- Systems, MTe, Multi-Tech Systems, National Instruments, Nexcom, Polyspace Technologies, Programming Research, Radisys, SSV Embedded Systems, Synplicity, Toshiba Electronics, Wind River (Correct on 22.06.2005)
You can find the up-to-date floorplan and full exhibitor listing at
www.edaexhibitions.com/ess/exhibition
The UK's largest event for system engineering & embedded software development
The UK's product showcase: |
The broadest range of applications: |
Microprocessors |
Wireless Networks |
Microcontrollers |
Consumer Devices |
Reconfigurable Architectures |
Data Processing |
Real-Time OS |
Security |
Software Development |
Automotive & Transport |
Embedded Application Development |
Aerospace |
System-on-Chip Design |
Defence |
Software Modelling |
Image Processing |
Digital Signal Processing |
Industrial Automation |
Bus-Based Modules |
Control & Monitoring |
High-Speed Interconnect |
Networking |
Testing Tools |
Medical Equipment |
Networking Protocols |
|
Conference Update
The ESS 2005 Conference has expanded significantly to provide a wide range of high-quality tracks covering both hardware and
software engineering.
We are joined by the editors of Electronics Weekly, the Object Management Group and the Professional Networks of the Institution of Electrical Engineers (IEE) as co-organisers and promoters of the Conference to ensure that ESS remains the UK's foremost event for the embedded systems
community.
i.FPGA Developer Forum - advanced FPGA devices, tools and applications, organised by the IEE PN for Microelectronics & Embedded Systems.
ii. Embedded MicroDeveloper Forum - state-of-the-art microprocessors and microcontrollers for embedded systems, organised by the editors of Electronics Weekly.
iiiSignal Integrity Engineering - real-world challenges for embedded system hardware engineering, organised by EDA Exhibitions.
iv.Embedded Test - software test and verification methods for embedded programmers, organised by the IEE PN for Microelectronics & Embedded Systems.
v.Embedded Communications - systems and devices for wireless and wired embedded networks, organised by the IEE PN for Microelectronics & Embedded Systems and EDA Exhibitions.
vi.Software Design & Modelling - object-oriented programming techniques, organised by the Object Management Group.
For last minute speaking opportunities please contact us immediately.
EDA Exhibitions Ltd
63/66 Hatton Garden, LONDON EC1N 8SR, UK Tel +44 (0)20 7681 1000 Fax +44 (0)20 7242 5124 www.edaexhibitions.com
www.embedded.co.uk
Sponsored by
</Standards>
ESE Magazine June 05
A Standard Individual:
C is dead!
<Written by> Chris Hills </W>
USUAL THIS is a 75% cut down version for print, Awith the full version available on my web site at www.phaedsys.org. These are my own personal
views.
Starting with Certification for Programmers (definitely not Licensing of Engineers). There appears to be some interest in this. I have started the ball rolling with the IEE (and hopefully the BCS by the time you read this). The question is what should be certified and how. There has already been a suggestion that there are Certified
Will three Certifications for Programmers suffice, and what should be in each?
Embedded/Graphics/Business Systems Programmers; that is three variations. So the question is, will three suffice and what should be in each and conversely what should be excluded?
The embedded community needs to get its act together, so we can define the level and structure. So email me at cert@phaedsys.org with any suggestions or if you think it is a good idea.
C is dead?
I had a surreal moment at a MISRA meeting a week ago. I realised C is dead! It was the inaugural meeting of the MISRA-Autocode group. A bit of a surprise as it is Matlab/Simulink biased rather than UML, which I and a few others were expecting. Why the need to adhere to MISRA-C for the output from an autocoder? (see web version)
Most of the UML and other autocode tools can talk directly to the compiler. Soon it will be common for many programmers, maybe the majority with the rise of the cheap ARM parts, to use code generators and never look at the C source code. Of course many will still work in C just as some still use assembler.
As the majority of industrial compilers are still based on C90+, for all intents C is, I think, if not on the decline, certainly stationary and not likely to move forward again.
I know this has been heralded before: CASE tools to take over the world! This time it is different. At the MISRAAutocode meeting there were representatives of all the main European car manufacturers and other major players in the automotive world. The tool vendors were there because their customers were. There is a real need from the industry: it is not the tool vendors pushing new hype.
Industry drives the "in-use" standards because the relevant parties usually work in the same commercial area and talk to each other, usually at trade shows and conferences...
Over a coffee ideas spring up then people start to do things. The commercial imperative speeds things along.
Yes it all happens at these shows. I have a sure fire way of getting to the shows on the web site. Have a look it could liberate you from the office for a day and do you (and your company) the world of good. Also in the web version is: why industrial panels work and why the C panel may be disbanded by BSI.
Although I don't usually do free adverts: Derek Jones has written a very detailed and authorative 1616 page commentary on the C99 standard. It contains the complete C99 standard! Download "The New C Standard" from his web site. That's right a FREE download of the complete book! See web version for this essential link. The full title is “The New C Standard: An Economic and Cultural History” and it contains a lot more than just an annotated C standard. Derek has written several compilers, code translators and analyzers including some that have been validated fully compliant to the relevant standard. He says that you don’t really understand a language until you have written a [validated] compiler for it.
So email me at cert@phaedsys.org with any suggestions
for the programmer's certification. |
<Ends> |
wwww.phaedsys.org |
|
Optimising |
Hardware |
The Leader in Embedded |
|
Debug |
Software Development |
||
Compilers |
|||
Probes |
|||
|
FREE 30-Day Product Evaluation |
||
|
|
||
Integrated |
Real-Time |
register now at www.ghs.com/eval |
|
|
|||
Development |
Operating |
|
|
Environments |
Systems |
|
Debugging & |
All |
Performance |
Royalty |
Analysis |
Free! |
Tel: +44 (0)1844 267950 Fax: +44 (0)1844 267955 Email: sales-uk@ghs.com
<Buyer's Guide>
ESE Magazine June 05
BG2
Digital Signal Processors
Buyer’s guide
<Written by> Dick Selwood </W>
A round-up of the latest devices and developments in DSPs.
Getting the best from the buyers guide
DIGITAL SIGNAL PROCESSORS (DSPs) are one of the great success stories of the last twenty years, providing a powerful tool that has been at the heart of many of the leading edge application areas: much multimedia and digital broadcasting would be impossible without them, for example, From stand-alone units they have evolved into becoming an integral part of many platforms and SoCs, and are now making their mark in FPGAs.
The guide is divided to reflect that and you will find tables for three categories: the traditional, standalone DSP, FPGAs and IP. (There will be lots more on IP for FPGAs in our November issue). Supporting this are lists of the manufacturers and their distributors. Once you have identified the devices that look interesting, you should be able to quickly find the manufacturer and/or distributor who can give you more detailed information.
Too busy?
When we started work on this buyers guide, we had hoped to bring you an authoritative round-up of the current major suppliers and many of the minor players. What we bring you is, unfortunately, less than this. It is still useful, we feel, but
we are aware that it is not truly comprehensive. Listing in the guide is free, and requires no more than the time it takes to fill out the form that we use to generate the tables, but when you look at the tables and the suppliers list, you will instantly see the absence of some well known names. Despite multiple e-mails and phone calls some have just not responded, one was too busy and one, a major player, didn’t want to take part, suggesting that the information was already on their web site. This same company sends out a considerable
number of press releases every month.
We have done our best with what we have received, and hope that you will find something interesting and useful.
Next year
Below is the list of buyers guides that we are planning to produce for the rest of this year. We are about to start planning next years schedule, so would be interested in hearing from you what guides you would like to see. Send your suggestions to: dick@edaltd.co.uk. Senders whose suggestions are taken up will be entered into a free draw for tickets to next year’s ESS conference.
Contents
BG4 ............ |
Stand alone devices |
BG6 ............ |
FPGAs |
BG7 ............ |
IP |
BG8 ............ |
Device manufacturers |
BG8 ............ |
Distributors |
Forthcoming buyers guides:
July/August: Batteries
September: Test automation October: PCI Express
November/December: IP for FPGAs
Dig deeper into DSPs at
www.esemagazine.co.uk
Multicore DSP
CEVA and Ignios have unveiled a reference platform that demonstrates multiple CEVATeak DSP cores seamlessly operating together using Ignios’ multicore-enabling SystemWeaver technology.
The demonstration platform brings together up to 16 CEVA-Teak DSP cores, with the capability for further scalability, and the SystemWeaver multicore management core in a representative SoC architecture. With the SystemWeaver approach, the software developer is presented with the same multi-threaded programming model (API) no matter how many processors are present in the SoC, considerably easing multicore software development and debug. The SystemWeaver IP core ensures that the result-
ing code executes efficiently on the available processing resources. This approach can be similarly utilized for CEVA-X or other homogenous or heterogeneous combinations of CEVA DSP cores.
Multicore designs are a growing requirement for compute-intensive cellular basestations and high channel density VoIP gateways. With SystemWeaver, code can easily be developed on a single processor and then quickly retargeted to all of the devices using dynamic and flexible scheduling policies for different classes of task and processing resource.
www.ignios.com
www.cevadsp.com
DSP in reconfigura- ble-processor SoC
ST’s STW21000 is a multi-purpose microcontroller for wireless infrastructure equipment applications. The STW22000, adds a 600MHz 16/32-bit dual-MAC DSP core to the 300MHz ARM926EJ-S RISC core, 16 Mbits of embedded DRAM, an eFPGA (embedded Field-Programmable Gate Array) block, reconfigurable interfaces, and a wide range of analog and digital peripherals such as A/D and D/A converters of the existing device. It was defined in co-operation with several leading wireless infrastructure manufacturers.
The additional ST122 DSP core combines VLIW and RISC. Also embedded a dedicated CDE (Convolutional Decoder Engine). Applications are baseband signal processing in 2G cellular modems and other signal-processing applications.
ST also provides a complete set of development tools for the embedded DSP core, to evaluate the performance, and to develop, debug, and integrate Application Code on the chip via an ARM/DSP environment, providing multi-Core Development/Debug capabilities.
www.st.com
I N T E L L I G E N T E L E C T R O N I C S S T A R T W I T H M I C R O C H I P
Take your designs to new heights with the PIC18F
M i c r o c h i p ’ s H i g h P i n - C o u n t , H i g h - D e n s i t y M e m o r y P I C ® M i c r o c o n t r o l l e r s
|
|
|
|
|
Package |
|
|
PWR Capture |
|
|
Pins |
Memory |
Program Sizes |
RAM |
Data EEPROM |
Types |
Serial I/O |
Analog |
Compare |
Timers |
|
PIC18F |
Flash |
4 to 64 kB |
128 B |
64 B |
DIP, QFN, |
I2C™, SPI™, RS-232, |
2 Comparators, |
10 bit |
8 & 16 bit |
|
40/44 |
|
|
to 4 kB |
to 1 kB |
TQFP |
RS-485, CAN, LIN |
10-bit A/D (up to |
(up to 2) |
(up to 4) |
|
|
|
|
|
|
|
|
13 channels) |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PIC18F |
Flash |
32 to 128 kB |
2 to 4 kB |
1 kB |
TQFP |
I2C, SPI, RS-232, |
2 Comparators, |
10 bit |
8 & 16 bit |
|
64/68 |
|
|
|
|
|
RS-485, CAN, LIN |
10-bit A/D (up to |
(up to 5) |
(up to 5) |
|
|
|
|
|
|
|
|
16 channels) |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PIC18F |
Flash |
32 to 128 kB |
2 to 4 kB |
1 kB |
TQFP |
I2C, SPI, RS-232, |
2 Comparators, |
10 bit |
8 & 16 bit |
|
80/84 |
|
|
|
|
|
RS-485, LIN |
10-bit A/D (up to |
(up to 5) |
(up to 5) |
|
|
|
|
|
|
|
|
16 channels) |
|
|
|
The sky is the limit for your next application: Microchip’s broad range of PIC® microcontrollers in 40to 80-pin packages have all the peripherals and memory your application needs. With up to 128 kB of Flash program memory, 40 MHz performance and
efficient C compilers, these devices have the power to launch any high-end application. Take off with Microchip by purchasing the PIC18FXX20 64-/80-Pin TQFP Demonstration Board from your local distributor or from buy.microchip.com!
http://buy.microchip.com |
www.microchip.com/highpin |
|
The Microchip name, logo and PIC are registered trademarks of Microchip Technology Incorporated in the USA and other countries. All other trademarks and registered trademarks are the property of their respective owners. © 2004 Microchip Technology Inc. All rights reserved. ME127Eng/09.04/B
<Buyer's Guide>
ESE Magazine June 05
Stand alone DSP devices
Company name |
Analog Devices |
Analog Devices |
Analog Devices |
Analog Devices |
Analog Devices |
Analog Devices |
Analog Devices |
Freescale Semiconductor |
Freescale Semiconductor |
|
|
|
|
|
|
|
|
|
|
||
|
|
|
|
|
|
|
|
|
|
|
DSP family designa- |
|
|
Blackfin ADSP |
|
|
|
|
|
MSC810x |
|
|
|
Blackfin ADSP |
Blackfin ADSP |
Blackfin ADSP |
Blackfin ADSP |
DSP56300 |
StarCore DSP |
|||
tion |
SHARC |
TigerSHARC |
BF531, BF532, |
BF534 |
BF535 |
BF536, BF537 |
BF561 |
core family |
single core |
|
|
|
|
BF533 |
|
|
|
|
|
with CPM |
|
|
|
|
|
|
|
|
|
|
||
|
|
|
|
|
|
|
|
|
|
|
Bus width (bits) |
32 bit-Fixed |
32 or 64-bit |
20/16 Async/ |
20/16 Async/ |
|
|
|
|
|
|
Point, 40 bit |
(user config- |
32 bit |
16 bit |
32 bit |
|
32/64 |
||||
|
Floating Point |
urable) |
Sync Bus |
Sync Bus |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|||
Instruction width (bits) |
|
32-bit opcode, |
16-bit, 32-bit, |
16-bit, 32-bit, |
16-bit, 32-bit, |
16-bit, 32-bit, |
16-bit, 32-bit, |
|
|
|
32-bit |
(4 opcodes / |
24 |
16 |
|||||||
|
|
cycle) |
64-bit |
64-bit |
64-bit |
64-bit |
64-bit |
|
|
|
|
|
|
|
|
|
|
|
|
||
|
|
|
|
|
|
|
|
|
|
|
Clock speed: (MHz) |
up to 400 |
up to 600 |
400MHz-750 |
400MHz-500 |
200MHz- |
300MHz- |
2 cores: 500- |
|
250/275/300 |
|
756MHz each |
275 |
|||||||||
MHz |
MHz |
MHz |
MHz |
350MHz |
600MHz |
MHz |
||||
|
core |
|
||||||||
|
|
|
|
|
|
|
|
|
||
Voltage: Core(V) |
1.2V |
1.05V or 1.2V |
0.8V-1.4V |
0.8V-1.2V |
1.0V-1.6V |
0.8V-1.2V |
0.8V-1.2V |
1.6/1.8/3.3 V |
1.2 V |
|
I/O(V) |
3.3V |
2.5V or 3.3V |
2.25V-3.6V |
2.25V-3.6V |
3.15V-3.45V |
2.25V-3.6V |
2.25V-3.6V |
3.3 V |
3.3 V |
|
Power used: Operat- |
|
|
264 mW @ |
TBD |
797mW |
TBD |
650 mW @ |
NA |
NA |
|
ing (Max) |
|
|
600MHz |
600 MHz |
||||||
|
|
|
|
|
|
|
||||
Power used: Power- |
|
|
Full-on, Active, Sleep, Deep sleep, Hibernate, (50uA) |
|
NA |
|||||
down modes |
|
|
|
|||||||
|
|
|
|
|
|
|
|
|
||
On-chip memory |
|
|
|
|
|
|
|
|
|
|
Type (1) |
|
|
up to 16KB |
16KB L1 |
16KB L1 |
16KB L1 |
32KB |
Programmable |
|
|
SRAM |
DRAM |
L1 Instruction |
Instruction |
Instruction |
Instruction |
Instruction |
SDRAM |
|||
|
|
|
SRAM/Cache |
SRAM/Cache |
SRAM/Cache |
SRAM/Cache |
SRAM/Cache |
SRAM |
|
|
Min |
|
4 Mbit |
|
|
|
|
|
24 KB |
512 KB |
|
Max |
3M bit |
24 Mbit |
|
|
|
|
|
576 KB |
512 KB |
|
Type (2) |
Programmable |
|
up to 64KB |
up to 48KB |
32KB L1 Data |
up to 48KB |
64KBL1Data |
|
|
|
|
L1 Instruction |
L1 Instruction |
L1 Instruction |
SRAM/cache |
Boot ROM |
|
||||
|
ROM |
|
SRAM |
SRAM |
SRAM/Cache |
SRAM |
percore(2cores) |
|
|
|
|
|
|
|
|
|
|||||
Min |
|
|
|
|
|
|
|
576 bytes |
|
|
Max |
6 Mbit |
|
|
|
|
|
|
9 KB |
|
|
Type (3) |
|
|
4KBScratchpad |
4KBScratchpad |
256KB L2 |
up to 32KB L1 |
128KB L2 |
|
|
|
|
|
RAM |
RAM |
SRAM |
Data SRAM |
SRAM |
|
|
||
|
|
|
|
|
||||||
Min |
|
|
|
|
|
|
|
|
|
|
Max |
|
|
|
|
|
|
|
|
|
|
I/O and Interfaces |
|
|
|
|
|
|
|
|
|
|
Serial (number) |
6 |
N/A |
2 |
2 |
4 |
5 |
3 |
3 |
8 |
|
USB (number) |
0 |
N/A |
|
|
1 |
|
|
0 |
0 |
|
A/D (number) |
0 |
N/A |
|
|
|
|
|
0 |
0 |
|
UART (number) |
2 |
N/A |
1 |
2 |
2 |
2 |
1 |
0 |
1 |
|
Ethernet (number) |
0 |
N/A |
|
|
|
1 |
|
0 |
2 |
|
|
|
|
|
|
|
|
|
|
|
|
Memory interface: DDR |
No |
No (SDRAM |
No |
No |
No |
No |
No |
No |
No |
|
is supported) |
||||||||||
Memoryinterface:SRAM |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
|
|
|
|
|
|
|
|
|
|
|
|
Memoryinterface:Flash |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
|
|
|
|
|
|
|
|
|
|
|
|
Buses |
Memory: 32bit |
|
|
|
|
|
|
Memory: 24bit |
System: |
|
|
|
|
|
|
|
Host: 8 or 32bit |
32/64-bit |
|||
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Temperature Range |
0 to 70 |
|
|
|
|
|
|
|
|
|
I= -40 to 85 |
-40 to 105 |
–40 to 70 |
–40 to 85 |
–40 to 70 |
–40 to 70 |
–40 to 70 |
–40 to 105 |
–40 to 105 |
||
(Min/Max) ºC |
||||||||||
A= -40 to 105 |
|
|
|
|
|
|
|
|
||
|
|
|
|
|
|
|
|
|
||
Application area |
|
|
|
|
|
|
|
|
|
|
Consumer |
Yes |
No |
Yes |
Yes |
Yes |
Yes |
|
Yes |
No |
|
Portable/hand held |
Yes |
No |
|
|
|
Yes |
Yes |
No |
No |
|
Industrial |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
No |
|
Automotove |
Yes |
No |
|
|
|
Yes |
Yes |
Yes |
No |
|
Aerospace/defence |
Yes |
Yes |
|
|
|
|
|
Yes |
Yes |
|
Telecomms |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
|
Yes |
Yes |
|
Computing |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
No |
No |
|
BG4