Frame D.Printed circuit board and connector impedance matching using complex conjugation.2004

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Lc2 n3 n4 'Lcon/lumps' rc3 n4 n5 'Rcon/lumps' cc3 n5 gnd 'Ccon/lumps' Lc3 n5 conout 'Lcon/lumps'

$compensation capacitor ccmpo conout gnd 'Ccomp/2'

wpcb2 conout gnd out gnd FSmodel=microstrip n=1 l='total_length/2' Rload out gnd load

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$Physical specification for a w-model transmission line

.MATERIAL diel dielectric er=4.3, losstangent=0.02

.material copper metal er=1 ur=0.9999 conductivity=58.1e6

.shape rect rectangle width=0.1667mm height=0.0305mm

.layerstack stack +layer=(PEC,0.0305mm),layer=(diel,0.1016mm)

.fsoptions opt1 printdata=yes computegd=yes computers=yes accuracy=high

+gridfactor=3

.model microstrip W modeltype fieldsolver,

+Layerstack = stack, fsoptions=opt1, RLGCFILE=micro1.rlgc +conductor = (shape(rect, origin=(0,0.1321mm),material=copper)

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.end